Display panel and repairing method thereof

ABSTRACT

A display panel, includes a base layer and an OLED device layer which is positioned on the base layer. A material of the base layer includes hydrogenated boron nitride nanosheets.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Chinese Patent Application No.201710278685.X, filed on Apr. 25, 2017, titled “DISPLAY PANEL ANDREPAIRING METHOD THEREOF”, which is incorporated herein by reference inits entirety.

TECHNICAL FIELD

The present disclosure relates to a display technology, moreparticularly, to a display panel and a repairing method thereof.

BACKGROUND

A flexible display panel easily becomes cracked when it is heavilybended. It is difficult to repair a cracked flexible display panel. Aflexible display panel is not able to display properly at the crackingregion, where its structures such as wirings etc., are broken.Accordingly, whole display quality of the product is affected.

SUMMARY

Embodiments of the present disclosure adopt the following technicalsolutions.

An aspect of the disclosure provides a display panel, comprising a baselayer and an OLED device layer which is positioned on the base layer,wherein a material for the base layer comprises hydrogenated boronnitride nanosheets.

Optionally, the hydrogenated boron nitride nanosheets comprisehydrogenated bilayered hexagonal boron nitride nanosheets.

Optionally, the display panel further comprises a protection layer whichcovers the OLED device layer, and the protection layer is made of athermoplastic resin material.

Optionally, the thermoplastic resin material comprises at least one ofpolyolefin, polyamide, polycarbonate, polyoxymethylene,polyphenyleneoxide, chlorinated polyether, polyvinyl chloride,polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).

Optionally, the material for the base layer further comprises athermoplastic resin material, and the hydrogenated boron nitridenanosheets disperse in the thermoplastic resin material.

Optionally, the thermoplastic resin material comprises at least one ofpolyolefin, polyamide, polycarbonate, polyoxymethylene,polyphenyleneoxide, chlorinated polyether, polyvinyl chloride,polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).

Another aspect of the disclosure provides a repairing method for thedisplay panel as any one of the above which is cracked, comprising:matching and joining together cracked parts of the display panel;applying pressure to the base layer, making a lattice constant of thehydrogenated boron nitride nanosheets be compressed.

Optionally, said matching and joining together cracked parts of thedisplay panel comprises: matching and joining together cracked parts ofthe display panel, making a plurality of the hydrogenated boron nitridenanosheets in the base layer where it has been cracked becorrespondingly inter-attracted and connected together by hydrogen bondinteraction.

Optionally, said applying pressure to the base layer, making a latticeconstant of the hydrogenated boron nitride nanosheets be compressedcomprises: by applying pressure to the base layer, making a latticeconstant of the hydrogenated boron nitride nanosheets be compressed,changing a plurality of the hydrogenated boron nitride nanosheets in thebase layer where it has been cracked from semiconductors intoconductors.

Optionally, in a situation of the hydrogenated boron nitride nanosheetscomprising hydrogenated bilayered hexagonal boron nitride nanosheets,said making a lattice constant of the hydrogenated boron nitridenanosheets be compressed comprises: making the lattice constant of thehydrogenated boron nitride nanosheets be compressed by about 7%˜9%, suchas 7%, 8%, 9% and so on.

Optionally, in a situation of the display panel further comprising aprotection layer which covers the OLED device layer, and the protectionlayer is made of a thermoplastic resin material, the repairing method,after a step of said matching and joining cracked parts of the displaypanel together, further comprises: heat-treating a region of theprotection layer which corresponds to a region where the cracked partsof the display panel are matched and joined together, making theprotection layer where it has been cracked be connected together.

Optionally, the thermoplastic resin material comprises at least one ofpolyolefin, polyamide, polycarbonate, polyoxymethylene,polyphenyleneoxide, chlorinated polyether, polyvinyl chloride,polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).

Optionally, in a situation of the thermoplastic resin material ispolyolefin, said heat-treating comprises: heating to a temperature ofabout 80° C., and retaining the temperature for about 30 min.

Optionally, in a situation of the material for the base layer furthercomprising a thermoplastic resin material, and the hydrogenated boronnitride nanosheets dispersing in the thermoplastic resin material, therepairing method, after a step of said matching and joining crackedparts of the display panel together, further comprises: heat-treating aregion of the base layer which corresponds to a region where the crackedparts of the display panel are matched and joined together, making thebase layer where it has been cracked be connected together.

Optionally, the thermoplastic resin material comprises at least one ofpolyolefin, polyamide, polycarbonate, polyoxymethylene,polyphenyleneoxide, chlorinated polyether, polyvinyl chloride,polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).

Optionally, in a situation of the thermoplastic resin material ispolyolefin, said heat-treating comprises: heating to a temperature ofabout 80° C., and retaining the temperature for about 30 min.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to describe technical solutions in embodiments of the presentdisclosure more clearly, the accompanying drawings to be used in thedescription of embodiments will be introduced briefly. Obviously, theaccompanying drawings to be described below are merely a part of theembodiments of the present disclosure, and a person of ordinary skill inthe art can obtain other drawings according to those drawings withoutpaying any creative effort.

FIG. 1 is a structure diagram of a display panel provided in anembodiment of the present disclosure.

FIG. 2 is a diagram of equilibrium structures of six configurations of asurface-hydrogenated bilayered BN (with a lateral view in the middle, atop view in the left, a bottom view in the right, the B atom shown as ahollow ball, the N atom shown as solid ball, and the H atom shown as asmall black ball for each equilibrium structure).

FIG. 3A is a diagram of distribution of charge density difference ofAB-BN structure.

FIG. 3B is a diagram of distribution of charge density difference ofAA-BN structure.

FIG. 4 is a diagram of the curve of changing of band gaps ofhydrogenated bilayered BN nanosheets under stress.

FIG. 5 is a first structure diagram of repairing a display panelprovided by an embodiment of the disclosure.

FIG. 6 is a second structure diagram of repairing a display panelprovided by an embodiment of the disclosure.

FIG. 7 is a third structure diagram of repairing a display panelprovided by an embodiment of the disclosure.

DETAILED DESCRIPTION

The technical solutions in the embodiments of the present disclosurewill be described clearly and completely with reference to theaccompanying drawings in the embodiments of the present disclosure.Obviously, the described embodiments are merely a part but not all ofthe embodiments of the present disclosure. All other embodiments made onthe basis of the embodiments of the present disclosure by a person ofordinary skill in the art without paying any creative effort shall beincluded in the protection scope of the present disclosure.

It should be indicated that, unless otherwise defined, each term(including technical term or scientific term) used in the embodiments ofthe present disclosure has the same meaning as that persons of ordinaryskills in the art commonly understand. It also should be understoodthat, each of the terms such as those defined in usual dictionariesshould be interpreted as having the meaning consistent with that in thecontext of the relevant technology, rather than interpreted with anidealized meaning or an extremely formalized meaning, unless expresslydefined like this herein.

For example, the word “include”, “comprise” or the like used in thespecification and claims of the present disclosure means that an elementor object preceding the word covers listed elements or objects and theirequivalents following the word, without excluding other elements orobjects. The orientation or ubiety indicated by terms “on side”, “theother side” or the like is an orientation or ubiety shown based on theaccompanying drawings, and is merely for describing the presentdisclosure and simplifying the description rather than indicating orimplying that the specified device or element must have a particularorientation or be constructed and operated in a particular orientation.Therefore, the terms should not be interpreted as limitations to thepresent disclosure.

In order to solve problems in the prior art, an embodiment of thepresent disclosure provides a display panel, and an embodiment of thepresent disclosure provides a repairing method thereof. The displaypanel, which has an OLED device layer positioned on a base layer whichis constituted by hydrogenated boron nitride (BN) nanosheets, canrecover circuits in cracked parts of an OLED device layer by treatingthe cracked parts using the structure characteristics of the nanosheets,so as to achieve the goal of repairing a cracked display panel andmaking it display properly.

After the display panel provided in an embodiment of the presentdisclosure is cracked, the cracked parts thereof are firstly joinedtogether, and a plurality of the hydrogenated BN nanosheets of the baselayer where it has been cracked are closely joined, taking advantage ofinterattraction of shared electrons of a hydrogen bond between surfacesof a plurality of the hydrogenated BN nanosheets. Next, the a pluralityof the hydrogenated BN nanosheets are compressed, and a lattice constantthereof is compressed accordingly, such that conductivity of theplurality of the hydrogenated BN nanosheets increases, making structuressuch as a broken wiring on the OLED device layer where it has beencracked can re-conduct through the a plurality of the hydrogenated BNnanosheets which are beneath the OLED device layer and conductive. As aresult, a circuit on the cracked region of the OLED device layerrecovers, making the display panel be able to proceed with displaying.

An embodiment of the present disclosure provides a display panel 100 asshown in FIG. 1. The display panel 100 comprises base layer 10 and OLEDdevice layer 20 which is positioned on the base layer 10. A material ofthe base layer 10 comprises hydrogenated boron nitride nanosheets.

It should be noted that, the foregoing “hydrogenated boron nitridenanosheet” means that a hydrogenated boron nitride nanosheet has a platytwo-dimensional structure whose sizes of two dimensions are both innanoscale. Specific ranges of the sizes can follow the prior art and arenot limited herein.

The foregoing “OLED device layer” means a device layer comprising anOLED (Organic Light-Emitting Display) device and a circuit structuresuch as a relevant wiring or the like. Specific structure of the OLEDdevice layer can follow the prior art and is not limited herein.

After the foregoing display panel is cracked, cracked parts thereof arematched and joined together. Then, a plurality of the BN nanosheets in ajoining region are very close to each other. Shared electrons of ahydrogen bond between surfaces of the plurality of the BN nanosheetswill be inter-attracted and makes the plurality of the BN nanosheets beclosely joined. Hydrogenated BN of the BN nanosheets is a semiconductormaterial whose band gap is adjustable, with a layered structure. Carriermobility of the hydrogenated BN is low in general state, so it isdifficult to form a conductive material. However, the semiconductormaterial of hydrogenated BN has a characteristic that its band gap isadjustable. It means that the band gap can become wider in a situationof the structure being stretched, and can become narrower in a situationof the structure being compressed. That is, when a hydrogenated BNmaterial is applied a pressure and is compressed accordingly, inside itsstructure, a stress (i.e., a force generated inside a material to resistan external force) is generated, so that a lattice constant iscompressed and the band gap becomes narrower. Because the band gapbecomes narrower, it is easier to generate an electron transition from avalence band, through the band gap, to a conduction band. Therefore, anelectronic carrier mobility increases, and the hydrogenated BN materialtransforms from a semiconductor into a conductor with a metalliccharacteristic. Contrarily, when the hydrogenated BN material is applieda tension and is stretched accordingly, inside its structure, anotherstress is generated, so that the lattice constant is stretched and theband gap becomes wider. Because the band gap becomes wider, it is moredifficult to generate the electron transition from the valence band,through the band gap, to the conduction band. As a result, thehydrogenated BN material transforms from a semiconductor into anon-conductive insulator.

Based on this, after the display panel with the foregoing structure iscracked or damaged the like (e.g., torn off), the cracked parts thereofare firstly joined together, and a plurality of the hydrogenated BNnanosheets are closely joined, taking advantage of interattraction ofshared electrons of a hydrogen bond between surfaces of a plurality ofthe hydrogenated BN nanosheets. Next, the a plurality of thehydrogenated BN nanosheets are compressed, and a lattice constantthereof is compressed accordingly, such that conductivity of the aplurality of the hydrogenated BN nanosheets increases, making structuressuch as a broken wiring on the cracked region of the OLED device layercan re-conduct through the plurality of the hydrogenated BN nanosheetswhich are beneath the OLED device layer and conductive. As a result, acircuit on the cracked region of the OLED device layer recovers, as thecracked region being repaired and healed, so the display panel canproceed with displaying.

Specific display effect of the foregoing display panel after repairedrelates to a specific structure (e.g., wirings as a gate line, a dataline, and so on, and an electrode) on the cracked region of the OLEDdevice layer, a length and a distribution of a crack, and is not limitedherein.

The foregoing hydrogenated boron nitride nanosheets can, for example,comprise hydrogenated bilayered hexagonal (or hexagon) boron nitridenanosheets with a better characteristic.

For one of the hydrogenated bilayered hexagonal boron nitridenanosheets, when a lattice constant thereof is compressed under stress,in a situation of the symmetry of its primitive cell unchanged, alattice constant in the X-Y plane changes while a lattice constant inthe Z direction is free (i.e., with variability). Biaxial strain of thehydrogenated BN with a structure of bilayered atomic sheet can beachieved by changing the lattice constant a. Studying the two stablestconfigurations in bilayered hexagonal structures of the hydrogenate BN,i.e., AB-BN and AA-BN, it is found that the band gab can become widerunder stretching and can become narrower under compression. In a strainprocess, its energy band structure keeps being a direct band gap. Whenthe lattice constant is compressed by around 7˜9%, such as 7%, 8%, 9%,etc., the two stablest configurations both transform from semiconductinginto metallic. It can be seen that the band gap of a hydrogenatedbilayered BN nanosheet can be continuously modulated by biaxial strain.Therefore, a broken circuit structure on the hydrogenated BN nanosheetscan recover, taking advantage of this characteristic of the hydrogenatedBN.

The specific structural principle of the foregoing hydrogenatedbilayered BN nanosheet is described as follows.

A bilayered BN nanosheet which is not hydrogenated has a structure of ahexagonal BN (h-BN) structure. For bilayered BN, there are two importantstructures. One is head-to-head form arrangement (named H-typehereinafter) and the other is stagger form arrangement (named B-typehereinafter).

There are two subtypes of the H-type:

i) each B (or N) atom in the upper layer locates right above a B (or N)atom in the lower layer;

ii) each B (or N) atom in the upper layer locates right above an N (orB) atom in the lower layer.

There are three subtypes of the B-type:

i) each N atom in the upper layer locates right above an N atom in thelower layer, while each B atom in the upper layer locates right abovethe center of a hexagon in the lower layer;

ii) each B atom in the upper layer locates right above a B atom in thelower layer, while each N atom in the upper layer locates right abovethe center of a hexagon in the lower layer;

each N (or B) atom in the upper layer locates right above a B (or N)atom in the lower layer, while each B (or N) atom in the upper layerlocates right above the center of a hexagon in the lower layer.

Based on the calculation of the above five configurations of thebilayered BN nanosheet which is not hydrogenated, there are only smalldifferences among binding energy of the five configurations of thebilayered BN.

Next, the parameters of the bilayered BN nanosheet which is hydrogenatedare shown in Table 1.

Table 1 average lattice constant α, average bond length d_(B-N) in onelayer, bond length of B-N, N-N or B-B between two layers, binding energy|E_(b)| and band gap value E_(g) of six configurations of a surfacedhydrogenated bilayered BN

TABLE 1 average lattice constant α, average bond length d_(B—N) in onelayer, bond length of B—N, N—N or B—B between two layers, binding energy|E_(b)| and band gap value E_(g) of six configurations of a surfacedhydrogenated bilayered BN In one Between layer, two layers, average bondlength Bond Lattice bond of B—N, length of Binding Band constant/ lengthN—N or B—H or energy gap Configuration nm d_(B—N)/nm B—B/nm N—H/nm|E_(b)|/eV E_(g)/eV H-type AA—B 0.257 0.157 0.156(N—N) 0.120(B—H) 39.6064.88 AA—BN 0.258 0.159 0.152(B—N) 0.103(N—H)0.120(B—H) 41.266 1.31 AA—N0.258 0.158 0.176(B—B) 0.104(B—H) 40.710 2.31 B-type AB—B 0.257 0.1570.154(N—N) 0.120(B—H) 39.634 4.97 AB—BN 0.258 0.159 0.150(B—N)0.103(N—H)0.120(B—H) 41.321 1.40 AB—N 0.258 0.158 0.175(B—B) 0.104(N—H)40.666 2.41

Based on the consideration of structural simplification, an embodimentof the present disclosure is illustrated in only one hydrogenationsituation. That is, in each surface of the bilayered BN, either B atomsor N atoms adsorb H atoms. In this situation, there are mainly sixconfigurations of H-adsorption as follows. For the situation of H-typei, each B (or N) atom in each surface absorbs one H atom, forming aconfiguration of AA-B (or AA-N). For the situation of H-type ii, each Batom and each N atom respectively located in the two surfaces absorbsone H atom, i.e., each B atom in one surface absorbs one H atom, andeach N atom in the other surface absorbs one H atom, forming aconfiguration of AA-BN. For the situation of B-type i, each B atom inthe two surfaces adsorbs one H atom, forming a configuration of AB-B.For the situation of B-type ii, each N atom in the two surfaces adsorbsone H atom, forming a configuration of AB-N. For the situation of B-typeiii, each B atom and each N atom respectively located in the twosurfaces absorbs one H atom, i.e., each B atom in one surface absorbsone H atom, and each N atom in the other surface absorbs one H atom,forming a configuration of AB-BN. By sufficient structural relaxation(that is a phenomemon that an atomic arrangement inside a materialstructure changes slowly with time or under annealing or the like, andeventually changes into a stabler atomic arrangement), six stableconfigurations of the surfaced hydrogenated bilayered BN nanosheet areobtained as shown in FIG. 2.

Accordingly, the corresponding lattice constants, bond lengths, bindingenergies and band gaps of the six configurations of the surfacedhydrogenated bilayered BN after optimization are shown in Table 1.

With reference to FIG. 2, for each layer of BN structure, when each B(or N) atom absorbs one H atom on the surface, the two layers of the BNare no longer bound by interaction of van der Waals force, but by astrong bond of B-N (or B-B, N-N) that is formed. Accordingly, a previousflat atomic plane is twisted into a zigzag structure, and the interlayerspace between the two layers of the bilayered BN greatly reduces. Withreference to Table 1, regarding the matter of bond length, a bond lengthformed by an N atom absorbing an H atom is about 0.103 nm which is equalto a bond length, 0.103 nm, of NH of a dimer in free state; a bondlength formed by an B atom absorbing an H atom is about 0.120 nm whichis similar with a bond length, 0.123 nm, of BH of a dimer in free state.This shows that the H atom and the BN nanosheet can form a strong bond.Due to the absorption of H atom, the previous sp² hybridization betweenthe B atom and the N atom in the plane structure of BN changes into sp³hybridization, making the interlayer space greatly reduce. Accordingly,between the two layers, the bond of B-N, B-B or N-N is formed. Among thebonds, the bond of B-N is the shortest (about 0.151 nm), the bond of B-Bis the longest (about 0.176 nm), and the bond of N-N is in between(about 0.154 nm). Therefore, between the two layers of the material ofthe hydrogenated BN, the bond of B-N is the strongest bond, and the bondlength of B-N between two layers is even shorter than that (about 0.159nm) in one layer. The bond length of B-N between two layers in the AB-BNconfiguration is shorter than that in the AA-BN configuration,indicating that the AB-BN configuration is stabler than the AA-BNconfiguration. With reference to Table 1, regarding the binding energy,among the six configurations of 1-hydrogenated bilayered BN, twoconfigurations, AB-BN and AA-BN, in which each B atom on one surfaceabsorbs an H atom and each N atom on the other surface absorbs an Hatom, the binding energy of the two are the largest (i.e., thestablest).

Further, formation energy of the foregoing hydrogenation system isdefined as follows:

E _(f) =E _(coh)[2H−(BN)₂ ]{E _(coh)[(BN)₂ ]+E _(coh)(H ₂)},

wherein, E_(coh)[2H-(BN)₂], E_(coh)[(BN)₂] and E_(coh)(H₂) arerespectively binding energy of the hydrogenated bilayered BN nanosheet,the non-hydrogenated bilayered BN nanosheet and an hydrogen molecule(taking the binding energy of H₂ being 4.48 eV as a basis).

To further describe bonding characteristics of atoms in the material ofthe hydrogenated BN, distributions of charge density differences inAB-BN and AA-BN, the two stablest structures, are illustrated in FIG. 3Aand 3B. A plane given in each of FIG. 3A and 3B is perpendicular to thetwo layers of BN, and all the six atoms are almost inside the plane.Evidently, charge distribution among atoms has apparent directivity.Charge of B-N is mainly concentrated between these two atoms, forming animage of a typical covalent bond and charge of H-B bond or H-N bond ismainly concentrated around the H atom. It means that H-B bond or H-Nbond has an apparent peculiarity of ionic bond (comprising partialcovalency). Thus, when this material is cut off or damaged, a hydrogenbond can fully recover at normal temperature and make the materialhealed.

To prove a property of the material of the hydrogenated BN underexternal stress, the biaxial strain of the hydrogenated bilayered BNatomic nanosheet is implemented by a simulation of changing the latticeconstant (in a situation of the symmetry of its primitive cellunchanged, a lattice constant in the X-Y plane changes while a latticeconstant in the Z direction is free). Studying the two stablestconfigurations of the hydrogenated bilayered BN nanosheet, it is foundthat the band gabs can become wider under stretching and can becomenarrower under compression. In a strain process, each energy bandstructure keeps being a direct band gap. When the lattice constants arecompressed by around 8%, as shown in FIG. 4, both the two stablestconfigurations transform from semiconducting into metallic.

On the basis of the above, further to improve repairing effect of thedisplay panel after cracked, as shown in FIG. 1, the foregoing displaypanel further comprises,

a protection layer 30 which covers the OLED device layer 20, wherein theprotection layer 30 is made of a thermoplastic resin material.

and/or, the material of the foregoing base layer 10 further comprisesthe thermoplastic resin material, and the hydrogenated BN nanosheetsdisperse in the thermoplastic resin material.

Regarding the latter situation of the hydrogenated BN nanosheetsdispersing in the thermoplastic resin material, the specific dopingratio of the hydrogenated BN nanosheets can be flexibly adjustedaccording to structural parameters such as the size of the displaypanel, minimum bending radius and the like, and is not limited herein.

The thermoplastic resin material generally consists of linearmacromolecular compounds, and a linear macromolecular compound is a longmolecular chain consisting mainly of repeating units. The thermoplasticresin material has a characteristic of being able to melt and softenwhen heated and cure into its original state after cooled. When thethermoplastic resin material is cracked, among the long molecularchains, chains in the cracked region are broken or frizzled. Aftercracked parts is joined and heated, an average length of molecularchains in the heating region becomes shorter, and randomnesscontinuously goes up. Previous apart chains have a new entanglement,making a crack-repairing region of the thermoplastic resin materialwhich has been damaged become firmer. And the crack-repairing regionwill be cracked into parts only if a greater force is applied.Accordingly, a goal of repairing and stabilizing is achieved by themolecular chains in cracked sections of the thermoplastic resin materialinterpenetrating again and forming entanglement structure due to thermalmotion.

That is, the foregoing thermoplastic resin material can be used as theprotection layer covering the OLED device layer, and/or can be used asthe base layer on which the OLED device layer is positioned. In eachsituation, an effect of repairing and reinforcing the foregoing displaypanel after cracked can be achieved.

The foregoing thermoplastic resin material can specifically comprise atleast one of polyolefin (comprising at least one of polyethylene,polypropylene, polystyrene and polybutene), polyamide, polycarbonate,polyoxymethylene, polyphenyleneoxide, chlorinated polyether, polyvinylchloride, polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).

On basis of the above, an embodiment of the present disclosure providesa repairing method for the display panel with the foregoing structuresafter cracked. The repairing method comprises:

S01, as shown in FIG. 5, matching and joining together the cracked partsof the display panel, forming a joining region.

accordingly, making a plurality of the hydrogenated boron nitridenanosheets in the base layer 10 where it has been cracked becorrespondingly inter-attracted and connected together by hydrogen bondinteraction;

S02, as shown in FIG. 6, applying pressure to the base layer, making alattice constant of the hydrogenated boron nitride nanosheets becompressed by a preset value,

accordingly, by applying pressure to the base layer, making a latticeconstant of the hydrogenated boron nitride nanosheets be compressed,changing a plurality of the hydrogenated boron nitride nanosheets in thebase layer 10 where it has been cracked from semiconductors intoconductors, and making an open-circuit region of cracked parts of theOLED device layer be connected again, as the OLED device layer 20 is“repaired to be connected up”.

It should be indicated that, in S02, in order to make a plurality of thehydrogenated boron nitride nanosheets of the base layer where it iscracked transform from semiconductors into conductors which canaccordingly conduct an open-circuit structure like metal, a latticeconstant of the plurality of the hydrogenated boron nitride nanosheetsin the cracked region needs to be compressed.

Specific ways of compressing can include but are not limited to onlyapplying pressure to the cracked region via relevant technical meansmaking a lattice constant in the cracked region compressed, orcompressing the whole base layer 10. In the latter situation, becauseonly the cracked region of the whole base layer 10 is damaged,randomness of this region is largest, and the cracked region undercompression from external force has a largest concentration of stressinside the material. Therefore, only the lattice constant in the crackedregion of the hydrogenated BN nanosheets can be compressed significantlyor sufficiently, causing a change from semiconducting into metallic.

In the situation of the hydrogenated boron nitride nanosheets comprisinghydrogenated bilayered hexagonal boron nitride nanosheets, the presetvalue of compressing the lattice constant is about 7%˜9%, such as 7%,8%, 9% and so on. Such compression degree of the lattice constant can bequantitatively controlled by relevant instrument. Specific principle canbe referred to the prior art, and is not elaborated herein.

On basis of the above, in the situation of the display panel furthercomprising the protection layer made of the thermoplastic resin materialwhich covers the OLED device layer,

the foregoing repairing method, after S01 above, further comprises:

S03, as shown in FIG. 7, heat-treating a region of the protection layerwhich corresponds to a region where the cracked parts of the displaypanel are matched and joined together, making the protection layer whereit has been cracked be connected together.

FIG. 7 is for illustration, and S03 can be processed after or before S02without limitation herein.

The foregoing thermoplastic resin material comprises at least one ofpolyolefin (comprising at least one of polyethylene, polypropylene,polystyrene and polybutene), polyamide, polycarbonate, polyoxymethylene,polyphenyleneoxide, chlorinated polyether, polyvinyl chloride,polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).

When the foregoing thermoplastic resin material is polyolefin (likepolypropylene), specific processes of heat-treating may comprise:heating to a temperature about 80° C., and retaining this temperaturefor about 30 min.

In the situation of the material for the foregoing base layer furthercomprising the thermoplastic resin material, and the hydrogenated boronnitride nanosheets dispersing in the thermoplastic resin material, theforegoing repairing method, after S01 above, further comprises:

heat-treating a region of the base layer which corresponds to a regionwhere the cracked parts of the display panel are matched and joinedtogether, making the base layer where it has been cracked be connectedtogether. This step can be processed after or before S02 withoutlimitation herein.

The foregoing thermoplastic resin material comprises at least one ofpolyolefin (comprising at least one of polyethylene, polypropylene,polystyrene and polybutene), polyamide, polycarbonate, polyoxymethylene,polyphenyleneoxide, chlorinated polyether, polyvinyl chloride,polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).

When the foregoing thermoplastic resin material is polyolefin (likepolypropylene), specific processes of heat-treating can comprise:heating to temperature of about 80° C., and retaining this temperaturefor about 30 min.

The foregoing descriptions merely show specific implementations of thepresent disclosure, and the protection scope of the present disclosureis not limited thereto. Any person of skill in the art can readilyconceive of variations or replacements within the technical scopedisclosed by the embodiments of the present disclosure, and thesevariations or replacements shall fall into the protection scope of thepresent disclosure. Accordingly, the protection scope of the presentdisclosure shall be subject to the protection scope of the claims.

Additional embodiments including any one of the embodiments describedabove may be provided by the disclosure, where one or more of itscomponents, functionalities or structures is interchanged with, replacedby or augmented by one or more of the components, functionalities orstructures of a different embodiment described above.

What is claimed is:
 1. A display panel, comprising a base layer and anOLED device layer which is positioned on the base layer, wherein amaterial for the base layer comprises hydrogenated boron nitridenanosheets.
 2. The display panel according to claim 1, wherein thehydrogenated boron nitride nanosheets comprise hydrogenated bilayeredhexagonal boron nitride nanosheets.
 3. The display panel according toclaim 1, wherein the display panel further comprises a protection layerwhich covers the OLED device layer, and the protection layer is made ofa thermoplastic resin material.
 4. The display panel according to claim1, wherein the material for the base layer further comprises athermoplastic resin material, and the hydrogenated boron nitridenanosheets disperse in the thermoplastic resin material.
 5. The displaypanel according to claim 3, wherein the thermoplastic resin materialcomprises at least one of polyolefin, polyamide, polycarbonate,polyoxymethylene, polyphenyleneoxide, chlorinated polyether, polyvinylchloride, polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).
 6. The display panel according to claim 4, whereinthe thermoplastic resin material comprises at least one of polyolefin,polyamide, polycarbonate, polyoxymethylene, polyphenyleneoxide,chlorinated polyether, polyvinyl chloride, polysulfone, polyphenylenesulfide, polyetheretherketone and poly(acrylic acid).
 7. A repairingmethod for the display panel according to claim 1 which is cracked,comprising: matching and joining together cracked parts of the displaypanel; applying pressure to the base layer, making a lattice constant ofthe hydrogenated boron nitride nanosheets be compressed.
 8. Therepairing method according to claim 7, wherein said matching and joiningtogether cracked parts of the display panel comprises: matching andjoining together cracked parts of the display panel, making a pluralityof the hydrogenated boron nitride nanosheets in the base layer where ithas been cracked be correspondingly inter-attracted and connectedtogether by hydrogen bond interaction.
 9. The repairing method accordingto claim 7, wherein said applying pressure to the base layer, making alattice constant of the hydrogenated boron nitride nanosheets becompressed comprises: by applying pressure to the base layer, making alattice constant of the hydrogenated boron nitride nanosheets becompressed, changing a plurality of the hydrogenated boron nitridenanosheets in the base layer where it has been cracked fromsemiconductors into conductors.
 10. The repairing method according toclaim 7, wherein in a situation of the hydrogenated boron nitridenanosheets comprising hydrogenated bilayered hexagonal boron nitridenanosheets, said making a lattice constant of the hydrogenated boronnitride nanosheets be compressed comprises: making the lattice constantof the hydrogenated boron nitride nanosheets be compressed by about7%˜9%.
 11. The repairing method according to claim 7, wherein in asituation of the display panel further comprising a protection layerwhich covers the OLED device layer and is made of a thermoplastic resinmaterial, the repairing method, after the step of matching and joiningtogether cracked parts of the display panel, further comprises:heat-treating a region of the protection layer which corresponds to aregion where the cracked parts of the display panel are matched andjoined together, making the protection layer where it has been crackedbe connected together.
 12. The repairing method according to claim 11,wherein the thermoplastic resin material comprises at least one ofpolyolefin, polyamide, polycarbonate, polyoxymethylene,polyphenyleneoxide, chlorinated polyether, polyvinyl chloride,polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).
 13. The repairing method according to claim 11,wherein in a situation of the thermoplastic resin material ispolyolefin, said heat-treating comprises: heating to a temperature ofabout 80° C., and retaining the temperature for about 30 min.
 14. Therepairing method according to claim 7, wherein in a situation of thematerial for the base layer further comprising a thermoplastic resinmaterial, and the hydrogenated boron nitride nanosheets dispersing inthe thermoplastic resin material, the repairing method, after the stepof matching and joining together cracked parts of the display panel,further comprises: heat-treating a region of the base layer whichcorresponds to a region where the cracked parts of the display panel arematched and joined together, making the base layer where it has beencracked be connected together.
 15. The repairing method according toclaim 14, wherein the thermoplastic resin material comprises at leastone of polyolefin, polyamide, polycarbonate, polyoxymethylene,polyphenyleneoxide, chlorinated polyether, polyvinyl chloride,polysulfone, polyphenylene sulfide, polyetheretherketone andpoly(acrylic acid).
 16. The repairing method according to claim 15,wherein in a situation of the thermoplastic resin material ispolyolefin, said heat-treating comprises: heating to a temperature ofabout 80° C., and retaining the temperature for about 30 min.